收藏本站

ADN8831
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Detailed Block Diagram .................................................................. 3
Specifications..................................................................................... 4
Electrical Characteristics ............................................................. 4
Absolute Maximum Ratings ............................................................ 6
Thermal Characteristics .............................................................. 6
ESD Caution .................................................................................. 6
Pin Configuration and Function Descriptions ............................. 7
Typical Performance Characteristics ............................................. 9
Theory of Operation ...................................................................... 11
Oscillator Clock Frequency ....................................................... 12
Data Sheet
Temperature Lock Indicator ..................................................... 13
Soft Start on Power-Up .............................................................. 13
Shutdown Mode ......................................................................... 13
Standby Mode ............................................................................. 13
TEC Voltage/Current Monitor ................................................. 13
Maximum TEC Voltage Limit .................................................. 13
Maximum TEC Current Limit ................................................. 14
Applications Information .............................................................. 15
Signal Flow .................................................................................. 15
Thermistor Setup........................................................................ 15
Thermistor Amplifier (Chop1) ................................................ 15
PID Compensation Amplifier (Chop2) .................................. 16
MOSFET Driver Amplifier ....................................................... 17
Outline Dimensions ....................................................................... 18
Ordering Guide .......................................................................... 18
Oscillator Clock Phase ............................................................... 12
REVISION HISTORY
8/12—Rev. 0 to Rev. A
Changes to Features and General Description Sections.............. 1
Moved Figure 2 ................................................................................. 3
Changes to Figure 2 .......................................................................... 3
Changes to Table 1 ............................................................................ 4
Changes to Table 2 and Table 3 ....................................................... 6
Changes to Figure 3 and Table 4 ..................................................... 7
Changes to Theory of Operation Section and Figure 12........... 11
Changes to Figure 14 and Figure 15............................................. 11
Changes to Oscillator Clock Frequency Section and Oscillator
Clock Phase Section ....................................................................... 12
Changes to Soft Start on Power-Up Section, Shutdown Mode
Section, Standby Mode Section, and TEC Voltage/Current
Monitor Section .............................................................................. 13
Changes to Figure 17 ...................................................................... 15
Changes to PID Compensation Amplifier (Chop2) Section .... 16
Changes to MOSFET Driver Amplifier Section and Figure 21 .. 17
Updated Outline Dimensions ....................................................... 18
Changes to Ordering Guide .......................................................... 18
9/05—Revision 0: Initial Version
Rev. A | Page 2 of 20
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*
相关PDF资料
ADP1043AFB100EVALZ BOARD EVALUATION ADP1043A 100W
ADP1046-100-EVALZ BOARD EVAL FOR ADP1046-100
ADP1048-600-EVALZ BOARD EVAL ADP1048-600
ADP190CB-EVALZ BOARD EVAL ADP190
ADP191CB-EVALZ EVAL BOARD FOR ADP191
ADP194CB-EVALZ BOARD EVAL FOR ADP194ACBZ
ADP195CP-EVALZ BOARD EVAL FOR ADP195ACPZ
ADP197CB-EVALZ BOARD EVAL FOR ADP197ACBZ
相关代理商/技术参数
ADN8831XCP 制造商:Analog Devices 功能描述:- Bulk
ADN8833ACBZ-R7 功能描述:IC THERMO COOLER DRIVER 25WLCSP 制造商:analog devices inc. 系列:* 零件状态:在售 标准包装:1
ADN8833ACPZ-R2 功能描述:IC THERMO COOLER DRIVER 24LFCSP 制造商:analog devices inc. 系列:- 包装:剪切带（CT） 零件状态:在售 应用:热电冷却器 电流 - 电源:2.1mA 电压 - 电源:2.7 V ~ 5.5 V 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:24-WFQFN 裸露焊盘，CSP 供应商器件封装:24-LFCSP-WQ（4x4） 标准包装:1
ADN8833ACPZ-R7 功能描述:IC THERMO COOLER DRIVER 24LFCSP 制造商:analog devices inc. 系列:- 包装:剪切带（CT） 零件状态:在售 应用:热电冷却器 电流 - 电源:2.1mA 电压 - 电源:2.7 V ~ 5.5 V 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:24-WFQFN 裸露焊盘，CSP 供应商器件封装:24-LFCSP-WQ（4x4） 标准包装:1
ADN8833CB-EVALZ 功能描述:ADN8833 - Power Management, Thermoelectric Cooler Evaluation Board 制造商:analog devices inc. 系列:- 零件状态:有效 主要用途:电源管理，热电冷却器 嵌入式:- 使用的 IC/零件:ADN8833 主要属性:2.7 V ~ 5.5 V 输入电压 辅助属性:- 所含物品:板 标准包装:1
ADN8833CP-EVALZ 功能描述:ADN8833 - Power Management, Thermoelectric Cooler Evaluation Board 制造商:analog devices inc. 系列:- 零件状态:有效 主要用途:电源管理，热电冷却器 嵌入式:- 使用的 IC/零件:ADN8833 主要属性:2.7 V ~ 5.5 V 输入电压 辅助属性:- 所含物品:板 标准包装:1
ADN8834ACBZ-R7 功能描述:IC THERMO COOLER DRIVER 25WLCSP 制造商:analog devices inc. 系列:* 零件状态:在售 标准包装:1
ADN8834ACPZ-R2 功能描述:Thermoelectric Cooler PMIC 24-LFCSP-WQ (4x4) 制造商:analog devices inc. 系列:- 包装:剪切带（CT） 零件状态:有效 应用:热电冷却器 电流 - 电源:3.3mA 电压 - 电源:2.7 V ~ 5.5 V 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:24-WFQFN 裸露焊盘，CSP 供应商器件封装:24-LFCSP-WQ（4x4） 标准包装:1